September 2006 – June 2008
MSc in physics and techniques of semiconductors, St. Petersburg State Polytechnic University, Faculty of Physical Science and Technology, Russia. Master’s degree with distinction (GPA: 5.0/5.0). Thesis “Numerical simulation of the laser-produced plasma radiation”.
September 2002 – June 2006
BSc in physics and techniques of semiconductors, St. Petersburg State Polytechnic University, Faculty of Physical Science and Technology, Russia. Bachelor’s degree with distinction (GPA: 5.0/5.0). Thesis “Methods of crystal assembly in semiconductors fabrication”.
02/2017 – present time
08/2020 – present time
04/2020 – present time
01/2018 – 03/2021
03/2013 – 01/2017
03/2010 – 03/2013
08/2008 – 02/2010
FORS Group (IT consultancy), Saint-Petersburg, Russia. Team Leader – Software Development.
09/2007 – 08/2008
04/2006 – 05/2007
NWIRAM (management consultancy), Saint-Petersburg, Russia. Business Analyst – Process Engineering.
Experienced in managing complex projects and distributed teams. Familiar with various project management techniques including Waterfall, Agile, Scrum, Kanban, Scrumban.
Tools: JIRA, Confluence, MS Project, Asana, MS Visio, SharePoint, Communication tools i.e. Microsoft Teams, Slack
Design and Modelling
Sequential and Mote Carlo Ray Tracing, RCWA (Rigorous Coupled-Wave Analysis), FEM (Finite-Element Methid), FDTD (Finite-difference time-doma), Fortran, Python, SQL.
Tools: UNIGIT, MC Grating, COMSOL Multiphysics, Lumerical, Zeemax, Matlab, Maple, Mathematica, MEDUSA (plasma thermodynamics modelling), FLYCHK (modelling of plasmas emission), AutoCAD, SolidWorks.
EExperienced of working and managing class 10 and class 100 cleanrooms. Experienced in maintenance of state-of-the-art equipment, monitoring health & safety procedures in the lab to reduce risk hazards and establish safe working environment.
Chemical vapour deposition (CVD), physical vapour deposition (PVD), e-beam evaporation and thermal annealing of thin films.
Tools: Moorfield nanoCVD-8G, Moorfield nanoPVD, Nordiko (magnetron sputtering).
E-beam Plasma and low-power RIE plasma based chemical modification of materials using Fluorine, Chlorine and Oxygen functional species.
Tools: JLS Designs RIE 80 Etching system, Moorfield Nano RTCH
Micro and Nanofabrication optical lithography, laser lithography, e-beam lithography, and nanoimprint lithography techniques. Device processing using plasma etching (RIE, ICP, IBE), wet-chemical etching, rapid thermal annealing (RTA).
Tools: EVG Nanoimprint Instruments, NanoBeam NB4 Electron Beam Lithography System, Durham Magneto Optics Laser Writer, HHV Auto 306 Thermal Evaporator, JLS Designs RIE 80 Etching System, LoadPoint Micro Ace 3 Dicing Saw, Oxford Instruments systems.
Materials and device characterization using atomic force microscopy (AFM), scanning-electron microscopy (SEM), focused ion beam (FIB) milling, energy-dispersive X-ray spectroscopy (EDX), X-ray diffraction (XRD), FTIR spectrometry, Raman spectroscopy, ellipsometry.
Tools: Renishaw RM1000 Raman system, Horiba Xplora Raman system, FEI SEM – FIB Dualbeam System, Oxford Instruments EDX, Keithley Source Meters (transport measurements), AIST SPM (AFM system), KLA-Tencor D-100 Surface Profiler, Zygo optical profilers.